Why monolithic dies stopped scaling and the industry moved to multi-die designs glued together by interposers and bridges. The yield math that forces the issue, the 2.5D/3D vocabulary, AMD Infinity Fabric versus Intel Foveros and EMIB versus Apple UltraFusion versus TSMC CoWoS, and the honest reality of where chiplets pay off and where they just add cost.
Chiplets
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Chiplets and Advanced Packaging: When the Die Stopped Scaling